Ikuo Shohji : rechercher sur Z-Library

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1

Solder joint reliability evaluation of chip scale package using a modified Coffin–Manson equation

Ikuo Shohji, Hideo Mori, Yasumitsu Orii

Journal:

Microelectronics Reliability

Année:

2004

Langue:

english

Fichier:

PDF, 405 KB

english, 2004

2

[IEEE 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2014.7.15-2014.7.16)] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Cu/Cu direct bonding by metal salt generation bonding technique with organic acid and its persistence of reformed layer

Koyama, Shinji, Hagiwara, Naoki, Shohji, Ikuo

Année:

2014

Langue:

english

Fichier:

PDF, 240 KB

english, 2014

3

[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Effect of fiber direction and temperature on mechanical properties of short fiber-reinforced PPS

Takahashi, Ryogo, Shohji, Ikuo, Seki, Yuki, Maruyama, Satoshi

Année:

2014

Langue:

english

Fichier:

PDF, 4.86 MB

english, 2014

4

Microstructures and Mechanical Properties of Welded Joints of Several High Tensile Strength Steel

Izumi, Takahiro, Kobayashi, Tatsuya, Shohji, Ikuo, Miyanaga, Hiroaki

Journal:

Materials Science Forum

Année:

2018

Langue:

english

Fichier:

PDF, 4.26 MB

english, 2018

5

Comparison of low-melting lead-free solders in tensile properties with Sn–Pb eutectic solder

Ikuo Shohji, Tomohiro Yoshida, Takehiko Takahashi, Susumu Hioki

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2004

Langue:

english

Fichier:

PDF, 277 KB

english, 2004

6

Effect of Formic Acid Surface Modification on Bond Strength of Solid-State Bonded Interface of Tin and Copper

Koyama, Shinji, Aoki, Yukinari, Shohji, Ikuo

Journal:

MATERIALS TRANSACTIONS

Année:

2010

Langue:

english

Fichier:

PDF, 2.13 MB

english, 2010

7

Joint Strength and Microstructure of SUS304 Brazed with Nickel-base Filler Metal for Heat Exchangers

Takayama, Satoshi, Arikura, Youhei, Shohji, Ikuo, Nakazawa, Takanori, Matsumoto, Ken, Hikita, Masanori

Journal:

Journal of the Japan Institute of Metals

Année:

2004

Langue:

english

Fichier:

PDF, 1.09 MB

english, 2004

8

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - An Evaluation of Fatigue Damage in Low-Cycle Range for Sn-3.5Ag, Sn-0.7Cu Lead-Free Solders and Sn-Pb Eutectic Solder Using Image Processing to Surface Feature

Takahashi, Takehiko, Hioki, Susumu, Shohji, Ikuo, Kamiya, Osamu

Année:

2005

Langue:

english

Fichier:

PDF, 5.94 MB

english, 2005

9

Comparison of Sn-5Sb and Sn-10Sb Alloys in Tensile and Fatigue Properties Using Miniature Size Specimens

Kobayashi, Tatsuya, Kobayashi, Kyosuke, Mitsui, Kohei, Shohji, Ikuo

Journal:

Advances in Materials Science and Engineering

Année:

2018

Langue:

english

Fichier:

PDF, 8.03 MB

english, 2018

10

[ASME ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems - Portland, Oregon, USA (July 6–8, 2011)] ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2 - Effect of Aging on Tensile Properties and Microstructures of Eutectic Sn-Pb Solder With Small Amounts of Au and Pd for Aerospace Application

Kikuchi, Ryou, Shohji, Ikuo, Saitoh, Yuta, Nemoto, Norio, Nakagawa, Tsuyoshi, Ebihara, Nobuaki, Iwase, Fusao

Année:

2011

Langue:

english

Fichier:

PDF, 879 KB

english, 2011

11

The Influence of Incorporated Additives in Lead-Free Electroless Nickel Plating Film on the Reliability of Solder Joint

Tsuchida, Tetsuyuki, Okubo, Toshikazu, Kano, Takahiro, Shohji, Ikuo

Journal:

Journal of Japan Institute of Electronics Packaging

Année:

2013

Langue:

english

Fichier:

PDF, 1.96 MB

english, 2013

12

A Study on Reliability of Pillar-Shaped Intermetallic Compounds Dispersed Lead-Free Solder Joint

Nakata, Yusuke, Kurasawa, Motoki, Hashimoto, Tomihito, Miki, Kenji, Shohji, Ikuo

Journal:

Materials Science Forum

Année:

2018

Langue:

english

Fichier:

PDF, 2.94 MB

english, 2018

13

Creep properties of Sn-8Mass%Zn-3Mass%Bi lead-free alloy

Ikuo Shohji, Colin Gagg, William J. Plumbridge

Journal:

Journal of Electronic Materials

Année:

2004

Langue:

english

Fichier:

PDF, 138 KB

english, 2004

14

Tensile properties of Sn–Ag based lead-free solders and strain rate sensitivity

Ikuo Shohji, Tomohiro Yoshida, Takehiko Takahashi, Susumu Hioki

Journal:

Materials Science and Engineering: A

Année:

2004

Langue:

english

Fichier:

PDF, 178 KB

english, 2004

15

Phosphorus Particle Composite Plating with Ni–P Alloy Matrix

Suzuki, Yosuke, Arai, Susumu, Shohji, Ikuo, Kobayashi, Eiji

Journal:

Journal of The Electrochemical Society

Année:

2009

Langue:

english

Fichier:

PDF, 842 KB

english, 2009

16

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - The Effects of Ag, Ni, and Ge elements in Lead-free Sn Base Solder Alloy

Yamashita, Mitsuo, Hidaka, Noboru, Shohji, Ikuo

Année:

2008

Langue:

english

Fichier:

PDF, 3.98 MB

english, 2008

17

Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size Package Solder Joint

Shohji, Ikuo, Tohei, Tomotake, Yoshizawa, Keisuke, Nishimoto, Masaharu, Ogawa, Yasushi, Kawano, Takayuki

Journal:

Key Engineering Materials

Année:

2008

Langue:

english

Fichier:

PDF, 493 KB

english, 2008

18

Effect of Properties of Underfill Materials on Thermal Stress Relief in Lead-Free Solder Joint of Chip Size Package

Shohji, Ikuo, Yoshizawa, Keisuke, Nishimoto, Masaharu, Kawano, Takayuki

Journal:

Key Engineering Materials

Année:

2007

Langue:

english

Fichier:

PDF, 263 KB

english, 2007

19

[IEEE 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Ipoh, Perak, Malaysia (2012.11.6-2012.11.8)] 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Effect of Ni, Ge and P addition in Sn-Ag-Cu lead-free solder on solder joint properties with electroless Ni/Au electrodes

Shohji, Ikuo, Arai, Ryohei

Année:

2012

Langue:

english

Fichier:

PDF, 1.34 MB

english, 2012

20

[IEEE 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Ipoh, Perak, Malaysia (2012.11.6-2012.11.8)] 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Investigation of wetting behavior of Sn-3Ag-0.5Cu solder paste to BGA solder ball

Yahya, Maryam Husna, Nakamura, Keisuke, Shohji, Ikuo, Housen, Toshihiro, Yamamoto, Yumi, Kaga, Yoshio

Année:

2012

Langue:

english

Fichier:

PDF, 852 KB

english, 2012

21

[IEEE 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Ipoh, Perak, Malaysia (2012.11.6-2012.11.8)] 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Effect of strain rate on tensile properties of miniature size lead-free alloys

Toyama, Yuichiro, Shohji, Ikuo

Année:

2012

Langue:

english

Fichier:

PDF, 2.15 MB

english, 2012

22

[IEEE 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Ipoh, Perak, Malaysia (2012.11.6-2012.11.8)] 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Effect of filler content on tensile properties of underfill material for flip chip bonding

Kitagoh, Shinya, Mitsugi, Hironao, Koyama, Shinji, Shohji, Ikuo

Année:

2012

Langue:

english

Fichier:

PDF, 2.33 MB

english, 2012

23

[IEEE 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Ipoh, Perak, Malaysia (2012.11.6-2012.11.8)] 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Effect of surface modification by citric acid on fluxless vacuum bonding of Cu with Sn-Cu alloy

Hayakawa, Masumi, Koyama, Shinji, Shohji, Ikuo

Année:

2012

Langue:

english

Fichier:

PDF, 2.26 MB

english, 2012

24

[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Effect of coupling agent on adhesion of underfill on copper

Mitsugi, Hironao, Shohji, Ikuo, Koyama, Shinji, Kitagoh, Shinya

Année:

2014

Langue:

english

Fichier:

PDF, 795 KB

english, 2014

25

[IEEE 2013 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2013.11.11-2013.11.13)] 2013 3rd IEEE CPMT Symposium Japan - Mechanical properties of Sn-58Bi, In-3Ag and SAC305 solders measured with fine diameter specimens

Hisada, Takashi, Shohji, Ikuo, Yamada, Yasuharu, Toriyama, Kazushige, Ueno, Mamoru

Année:

2013

Langue:

english

Fichier:

PDF, 671 KB

english, 2013

26

[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Impact properties of Sn-3Ag-0.5Cu solder ball joint with epoxy-based flux

Ishiyama, Akiyoshi, Shohji, Ikuo, Ganbe, Tatsuya, Watanabe, Hirohiko

Année:

2014

Langue:

english

Fichier:

PDF, 1.86 MB

english, 2014

27

Analysis of Stress-Strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package Solder Joints

Shohji, Ikuo, Kobayashi, Tatsuya, Tohei, Tomotake

Journal:

Key Engineering Materials

Année:

2011

Langue:

english

Fichier:

PDF, 538 KB

english, 2011

28

Cu/Cu direct bonding by metal salt generation bonding technique with organic acid and persistence of reformed layer

Koyama, Shinji, Hagiwara, Naoki, Shohji, Ikuo

Journal:

Japanese Journal of Applied Physics

Année:

2015

Langue:

english

Fichier:

PDF, 1.63 MB

english, 2015

29

Cu/Cu Direct Bonding by Metal Salt Generation Bonding Technique with Formic Acid and Citric Acid

Hagiwara, Naoki, Koyama, Shinji, Shohji, Ikuo

Journal:

Advanced Materials Research

Année:

2014

Langue:

english

Fichier:

PDF, 682 KB

english, 2014

30

Effect of Strain Rate on Tensile Properties of Miniature Size Specimens of Several Lead-Free Alloys

Shohji, Ikuo, Toyama, Yuichiro

Journal:

Materials Science Forum

Année:

2014

Langue:

english

Fichier:

PDF, 6.99 MB

english, 2014

31

Effect of Interfacial Reaction in Sn-Ag-Cu Solder Alloy with Ni Addition

Watanabe, Hirohiko, Shimoda, Masayoshi, Hidaka, Noboru, Shohji, Ikuo

Journal:

Key Engineering Materials

Année:

2011

Langue:

english

Fichier:

PDF, 550 KB

english, 2011

32

Development of Cu Brazing Sheet with Cu-P Composite Plating

Shohji, Ikuo, Arai, Susumu, Kano, Naoki, Otomo, Noboru, Uenishi, Masahisa

Journal:

Key Engineering Materials

Année:

2007

Langue:

english

Fichier:

PDF, 453 KB

english, 2007

33

Influence of Surface Finish of Cu Electrode on Shear Strength and Microstructure of Solder Joint with Sn-3Ag-0.5Cu

Shohji, Ikuo, Goto, Hiroki, Nakamura, Kiyotomo, Ookubo, Toshikazu

Journal:

Key Engineering Materials

Année:

2005

Langue:

english

Fichier:

PDF, 454 KB

english, 2005

34

Impact Properties of Sn-0.75Cu Lead-Free Solder Ball Joint

Shohji, Ikuo, Osawa, Tsutomu, Okashita, Takeshi, Watanabe, Hirohiko

Journal:

Key Engineering Materials

Année:

2008

Langue:

english

Fichier:

PDF, 387 KB

english, 2008

35

Low Cycle Fatigue Behavior and Surface Feature by Image Processing of Sn-0.7Cu Lead-Free Solder

Takahashi, Takehiko, Hioki, Susumu, Shohji, Ikuo, Kamiya, Osamu

Journal:

Key Engineering Materials

Année:

2006

Langue:

english

Fichier:

PDF, 3.20 MB

english, 2006

36

Estimation of Thermal Fatigue Resistance of Sn-Bi (-Ag) and Sn-Ag-Bi-Cu Lead-Free Solders Using Strain Rate Sensitivity Index

Yasuda, Kiyokazu, Shohji, Ikuo, Takemoto, Tadashi

Journal:

Materials Science Forum

Année:

2008

Langue:

english

Fichier:

PDF, 853 KB

english, 2008

37

High-Speed Bonding of Resin-Coated Cu Wire and Sn Electrode with Ultrasonic Bonding for High-Frequency Chip Coil

Shohji, Ikuo, Sakurai, Tsukasa, Arai, Shinji

Journal:

Key Engineering Materials

Année:

2005

Langue:

english

Fichier:

PDF, 618 KB

english, 2005

38

An Evaluation of Low-Cycle Fatigue Property for Sn-3.5Ag and Sn-0.7Cu Lead-Free Solders Using Surface Deformation

Takahashi, Takehiko, Hioki, Susumu, Shohji, Ikuo, Kamiya, Osamu

Journal:

Key Engineering Materials

Année:

2006

Langue:

english

Fichier:

PDF, 602 KB

english, 2006

39

Solid State Bonding of Al Alloy/SUS304 by Metal Salt Generation Bonding Technique with Acetic Acid

Matsubara, Kota, Koyama, Shinji, Nagata, Hideo, Suda, Yoshiyuki, Shohji, Ikuo

Journal:

Advanced Materials Research

Année:

2014

Langue:

english

Fichier:

PDF, 1.33 MB

english, 2014

40

Effect of Ni Content on Dissolution Properties of Cu in Molten Sn-Ag-Cu-Ni-Ge Alloy

Watanabe, Hirohiko, Nagai, Marie, Osawa, Tsutomu, Shohji, Ikuo

Journal:

Key Engineering Materials

Année:

2011

Langue:

english

Fichier:

PDF, 464 KB

english, 2011

41

Boron Particle Composite Plating with Ni–B Alloy Matrix

Arai, Susumu, Kasai, Shuji, Shohji, Ikuo

Journal:

Journal of The Electrochemical Society

Année:

2010

Langue:

english

Fichier:

PDF, 1.34 MB

english, 2010

42

Influence of Content of Ni and Ag on Microstructure and Joint Strength of Lead-Free Solder Joint with Sn-Ag-Cu-Ni-Ge

Shohji, Ikuo, Tsunoda, Satoshi, Watanabe, Hirohiko, Asai, Tatsuhiko

Journal:

Key Engineering Materials

Année:

2007

Langue:

english

Fichier:

PDF, 850 KB

english, 2007

43

Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-Free Solder Ball Joints

Shohji, Ikuo, Shimoyama, Satoshi, Ishikawa, Hisao, Kojima, Masao

Journal:

Key Engineering Materials

Année:

2008

Langue:

english

Fichier:

PDF, 394 KB

english, 2008

44

Effect of Se Content in High-Cyanide Silver Plating Solution on {200} Crystal Plane Orientation Ratio of Electrodeposited Silver Layer

Miyazawa, Hiroshi, Ogata, Masafumi, Shinohara, Keisuke, Sugawara, Akira, Shohji, Ikuo

Journal:

Materials Science Forum

Année:

2014

Langue:

english

Fichier:

PDF, 553 KB

english, 2014

45

Effect of Interfacial Reaction on Joint Strength of Semiconductor Metallization and Sn-3Ag-0.5Cu Solder Ball

Yorita, Chiko, Kobayashi, Tatsuya, Shohji, Ikuo

Journal:

Key Engineering Materials

Année:

2011

Langue:

english

Fichier:

PDF, 780 KB

english, 2011

46

Mechanical Properties and Microstructure of SUS304 Brazed Joint with Ni-Based Filler Metals Added Cr Powder

Shohji, Ikuo, Takayama, Satoshi, Nakazawa, Takanori, Matsumoto, Ken, Hikita, Masanori

Journal:

Key Engineering Materials

Année:

2005

Langue:

english

Fichier:

PDF, 1.28 MB

english, 2005

47

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Tensile properties of low-melting point Sn-Bi-Sb solder

Kubota, Yuto, Shohji, Ikuo, Tsuchida, Tetsuyuki, Nakamura, Kiyotomo

Année:

2014

Langue:

english

Fichier:

PDF, 813 KB

english, 2014

48

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Mechanical properties of low-silver Sn-1.0Ag-0.7Cu-1.6Bi-0.2In solder

Takahashi, Yuki, Shohji, Ikuo

Année:

2014

Langue:

english

Fichier:

PDF, 493 KB

english, 2014

49

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Effect of temperature on tensile properties of high-melting point Bi system solder

Zhang, Haidong, Shohji, Ikuo, Shimoda, Masayoshi, Watanabe, Hirohiko

Année:

2014

Langue:

english

Fichier:

PDF, 1.45 MB

english, 2014

50

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Joint strength and microstructures of brazed joints of stainless steel with Fe-based filler

Tsunoda, Takahiro, Shi, Kangdao, Shohji, Ikuo, Matsu, Kotaro, Taguchi, Yasuhiro

Année:

2014

Langue:

english

Fichier:

PDF, 1.57 MB

english, 2014